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Chia-Yen Lee

3 accepted papers

2022

Spatio-Temporal Anomaly Detection for Substrate Strip Bin Map in Semiconductor Assembly Process

RA-L 2022

With the development of deep learning, data-driven approaches have shown great success in the semiconductor manufacturing. For example, wafer bin maps (WBM) recognition is a critical application to identify failure modes and finding root-cause to reduce yield loss. However, the WBM studies provide s

Cited by 3SourceScholar