2026
Point Cloud Segmentation of Integrated Circuits Package Substrates Surface Defects Using Causal Inference: Dataset Construction and Methodology
AAAI 2026technical
The effective segmentation of 3D data is crucial for a wide range of industrial applications, especially for detecting subtle defects in the field of integrated circuits (IC). Ceramic package substrates (CPS), as an important electronic material, are essential in IC packaging owing to their superior