4 accepted papers
The pursuit of high yield in semiconductor packaging manufacturing is hindered by the increasing complexity of monitoring and alarm systems, leading to alarm floods which not only interfere with operations but also mask critical issues affecting yield. Therefore, this letter proposes an Alarm Patter
Virtual Metrology (VM) technology can convert offline sampling inspection into online and real-time total inspection. As the processes of high-tech industries (semiconductor or TFT-LCD) are getting more sophisticated, higher VM prediction accuracy is demanded. With regard to this requirement, the ad
Root-cause Analysis (RCA) of alarms is a well-established research area in automated Production Systems (aPS). Many RCA algorithms have been proposed and successfully evaluated and new ones are being developed. Recently, researchers focus on the incorporation of formalized information about the tech
Chip-probing is the key process for IC manufacturing to its ensure quality. As the number of tests increases, the test quality and the test yield will be affected because the needles on the probe card of the tester will be contaminated by external objects or worn out. Whether a needle polish of the