11 accepted papers
High-precision wafer metrology poses significant cost and throughput challenges in modern semiconductor manufacturing, where frequent process changes and recipe variations demand highly adaptive and scalable solutions. In this paper, we present a Generative-FewShot-Active Virtual Metrology (GFA-VM) …
As semiconductor manufacturing complexity escalates, the intricacy of corresponding manufacturing systems intensifies. These extensive systems necessitate diverse engineering expertise for effective operation and analysis. For instance, yield engineers analyze yield systems, process engineers interp
This paper introduces a novel approach to analyzing the forward-looking statements in equity research reports by integrating argument mining with sentiment analysis. Recognizing the limitations of traditional models in capturing the nuances of future-oriented analysis, we propose a refined categoriz…
Chip-probing is the key process for IC manufacturing to its ensure quality. As the number of tests increases, the test quality and the test yield will be affected because the needles on the probe card of the tester will be contaminated by external objects or worn out. Whether a needle polish of the
To ensure stable processing and high-yield production, high-tech factories (e.g., semiconductor, TFT-LCD) demand product quality total inspection. Generally speaking, sampling inspection only measures a few samples and comes with metrology delay, thus it usually cannot achieve the goal of real-time
To ensure stable manufacturing and high yield of production, factories (e.g., semiconductor or TFT-LCD fabs) conduct quality inspection on workpieces. They tend to adopt sampling inspection in consideration of reducing cost and cycle time, yet that fails to achieve real-time and online total inspect
Carbon fiber is currently one of the most popular composite materials in the world, with its wide applications ranging from bikes to space shuttles. However, there is no comprehensive method for the total quality inspection of carbon fiber products so far due to its feature of continuous production
Predictive maintenance aims to find out when the target device (TD) is in the sick state and almost entering the dead state before its actual occurrence to conduct just-in-time maintenance, so as to avoid unexpected TD down time. In this way, not only tool availability and manufacturing quality are
With the trend of even smaller workpieces and complicated processes in the semiconductor industry, yield enhancement becomes the crucial indicator of enterprise profits. However, the advancement of the manufacturing processes results in huge-and-complicated data, it becomes difficult to quickly sear
Product yield directly affects production cost. Thus manufacturers seek to quickly enhance product yield during the development and mass-production processes. In other words, when a yield loss occurs, the root causes should be found rapidly in both the development and mass-production phases. When a
Yield enhancement is crucial for the companies' profitability performance, especially during the development and mass production phases. So, the root causes of yield loss should be quickly identified in these stages for saving the production cost. To identify the root causes, traditional yield enhan