6 accepted papers
Chip-probing is the key process for IC manufacturing to its ensure quality. As the number of tests increases, the test quality and the test yield will be affected because the needles on the probe card of the tester will be contaminated by external objects or worn out. Whether a needle polish of the
In this letter, we propose a novel smart livestock surveillance system through cooperation of AIoT (artificial intelligence of things) devices and the cloud computing platform, aiming at providing semantic information via assembling deep networks with AIoT devices of limited resource. The key of the
Electrical discharge machining (EDM) can machine hard conductive workpieces that are difficult to machine using traditional machining techniques. For monitoring the EDM process using virtual metrology (VM), probes with a very high sampling rate are needed to acquire the voltage and current signals o
Cloud manufacturing (CMfg) has emerged as a next-generation manufacturing paradigm that has potential to revolutionize the manufacturing industry. In further promotion of CMfg, how to build CMfg services in an automatic and efficient manner is an essential and challenging subject. Currently, there i
As semiconductor manufacturing processes are becoming more and more sophisticated, how to maintain their feasible production yield becomes an important issue. Also, how to build a smart manufacturing platform that can facilitate realizing smart factories is essential and desirable for current manufa
Industry 4.0 is set to be one of the new manufacturing objectives. The technologies involved to achieve Industry 4.0 are Internet of Things (IoT), cyber physical systems (CPS), and cloud manufacturing (CM). However, the current objectives defined by Industry 4.0 do not include zero defects; it only