3 accepted papers
Detecting defects buried inside chips is critical for failure analysis in semiconductor manufacturing. In this paper, we perform 3D voxel segmentation on 2.5D semicon chips to locate and identify defects that may be present in them. We integrate tree based Ensemble method with the Cascaded Anisotrop…
With the increasing global popularity of self-driving cars, there is an immediate need for challenging real-world datasets for benchmarking and training various computer vision tasks such as 3D object detection. Existing datasets either represent simple scenarios or provide only day-time data. In th…
Advances in Unmanned Aerial Vehicle (UAV) opens venues for application such as tunnel inspection. Owing to its versatility to fly inside the tunnels, it can quickly identify defects and potential problems related to safety. However, long tunnels, especially with repetitive or uniform structures pose…